高分解能 3D X線

Ultra-High Resolution 3D X-ray Microscope

 Non-destructive analysis of MEMS, 3D IC and PCB.

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Applications/ Advantages:

l   Versatile Applications in Microelectronics/Materials Science/Natural Resources & Life Sciences

l   Direct Imaging for IC Packages, MEMS, and PCB.

l   Inspection of various failures in packaged devices (solder bump open / wire short / voids / crack / metal bridges / miss-alignment etc.)

l   Ultra-High spatial resolution (~ 700 nm) at package level. Resolution will not degrade as sample sizes increase. 8"/12" wafers can be accommodated.

l   Ultra-High spatial resolution (~ 700 nm) at package level. Resolution will not degrade as sample sizes increase. 8"/12" wafers can be accommodated.

l   Composition contrast is feasible.

l   Phase contrast may differentiate light elements (ex: "Si" vs "Al" ).

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uContact technical window:

    Mr. Lin         TEL: +886-952-301-657     E-mail:hc_pfa@ma-tek.com