高分解能 SAT

High Resolution SAT

Take acoustic imaging to the next level , our system is equipped

with the broadest range of transducer 15~230MHz selectable

for Microelectronics, LEDs, MEMS, Power Modules, High-Tech device etc.

It can penetrate and detect  IC packages thicker than 4mm.

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Application:
A. Package crack

B. Delamination
C. Die crack
D. Void in resin
E. Poor die attachment
F. Poor contact of metal pillars

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uContact window: 

     Mr. Hu TEL: +886-3-6116678, ext.1650, E-mail: edward@ma-tek.com